* Oxidation / Anneal Mini Brute 150mm dia furnace.
* 8 KW two Ebeam gun 36" Sloan Evaporator.
* 8 KW 4 pocket Ebeam gun Evaporator.
* Technic Hummer 4 target DC sample sputter.
* Suss 150mm MA6/BSA6/BA6 front/back side mask aligner / Triple stack bond aligner.
* Brewer Science spinner / hot plate up to 200mm with one / two side capability.
* Suss wafer spinner with one / two side capability.
* Soft/Hard back Blue M ovens.
* Soft/hard bake programmable hot plates
* Technics Plama etcher.
* Wet etch self modified temperature controled baths.
* Acid / solvent benches
* Electoless nickel / Gold / copper tanks.
* Electroplating electroforming baths ? potentiostatic + pulsed process.
* Suss SB6 150mm substrate bonder (anodic / eutectic / thermocompression/ direct / adhesive).
* Self made 100mm anodic Bonder.
* Self made glass frit bonder.* Microautomation 1006 Dicing Saw.
* Disco DAD 721 dicing Saw 150mm.* Buhler wafer polisher modifide for CMP.
* Tecnor Alphastep surface profiler.
* UBM laser XY surface profiles.
* 50nm PI stages XY measurement microscope/ probe station.
* Nanometrics film thickness measurement system.
* Jeol T300 SEM.
* Misc. optical & electronic characterization equipment.